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North America Advanced IC Substrates Market 2022-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, FC Bonding, TAB), Application (Mobile and Consumer Electronics, Automotive and Transportation, IT and Telecom, Others), and Country: Trend Forecast and Growth Opportunity

North America Advanced IC Substrates Market 2022-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, FC Bonding, TAB), Application (Mobile and Consumer Electronics, Automotive and Transportation, IT and Telecom, Others), and Country: Trend Forecast and Growth Opportunity

Bonafide Trust 30-04-2023 125 Pages Figures : 46 Tables : 51
Region : North America Category : IT & Telecommunications Technology

North America advanced IC substrates market is projected to grow by 6.8% annually in the forecast period and reach $1,919.2 million by 2031, driven by the rising adoption of advanced substrates in manufacturing of electronics, the increasing prevalence and functionality of consumer electronic products sch as smart devices and smart wearables, and the increasing penetration of advanced technologies such as 5G and IoT connected devices. Highlighted with 51 tables and 46 figures, this 125-page report “North America Advanced IC Substrates Market 2022-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, FC Bonding, TAB), Application (Mobile and Consumer Electronics, Automotive and Transportation, IT and Telecom, Others), and Country: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire North America advanced IC substrates market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2021-2022 and provides forecast from 2023 till 2031 with 2022 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) In-depth qualitative analyses include identification and investigation of the following aspects: • Market Structure • Growth Drivers • Restraints and Challenges • Emerging Product Trends & Market Opportunities • Porter’s Fiver Forces The trend and outlook of North America market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify North America advanced IC substrates market in every aspect of the classification from perspectives of Packaging Type, Material Type, Manufacturing Method, Bonding Technology, Application, and Country. Based on Packaging Type, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section. • FC BGA • FC CSP • Other Packaging Types Based on Material Type, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section. • Rigid Integrated Circuit Substrate • Flex Integrated Circuit Substrate • Ceramic Integrated Circuit Substrate By Manufacturing Method, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section. • Subtraction Process (SP) • Addition Process (AP) • Modified Semi-additive Process (MSAP) By Bonding Technology, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section. • Wire Bonding • FC Bonding • Tape Automated Bonding (TAB) By Application, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section. • Mobile and Consumer Electronics • Automotive and Transportation • IT and Telecom • Other Applications Geographically, the following national/local markets are fully investigated: • U.S. • Canada • Mexico For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2022-2031. The breakdown of national markets by Packaging Type, Material Type and Application over the forecast years is also included. The report also covers the current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players. Selected Key Players: ASE Group AT&S Austria Technologie & Systemtechnik AG Fujitsu Ltd. IBIDEN Co., Ltd. Kinsus Interconnect Technology Corp. Korea Circuit Co., Ltd. KYOCERA Corporation LG Innotek Co., Ltd. Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation) Shenzhen Fastprint Circuit Tech Shinko Electric Industries Co., Ltd. Siliconware Precision Industries Co., Ltd. STATS ChipPAC Pte. Ltd. (JCET GROUP CO. LTD) TTM Technologies Inc. Unimicron Corporation Zhen Ding Technology Holding Ltd. Zhuhai ACCESS Semiconductor (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)

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