Global Advanced IC Substrates Market 2022-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, FC Bonding, TAB), Application (Mobile and Consumer Electronics, Automotive and Transportation, IT and Telecom, Others), and Region: Trend Forecast and Growth Opportunity

Bonafide Trust 30-04-2023 187 Pages Figures : 82 Tables : 110
Region : Global Category : IT & Telecommunications Technology

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Global advanced IC substrates market will reach $16,953.8 million by 2031, growing by 7.3% annually over 2022-2031, driven by the rising adoption of advanced substrates in manufacturing of electronics, the increasing prevalence and functionality of consumer electronic products such as smart devices and smart wearables, and the increasing penetration of advanced technologies such as 5G and IoT connected devices. Highlighted with 110 tables and 82 figures, this 187-page report “Global Advanced IC Substrates Market 2022-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, FC Bonding, TAB), Application (Mobile and Consumer Electronics, Automotive and Transportation, IT and Telecom, Others), and Region: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire global advanced IC substrates market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2021-2022 and provides forecast from 2023 till 2031 with 2022 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) In-depth qualitative analyses include identification and investigation of the following aspects: • Market Structure • Growth Drivers • Restraints and Challenges • Emerging Product Trends & Market Opportunities • Porter’s Fiver Forces The trend and outlook of global market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify global advanced IC substrates market in every aspect of the classification from perspectives of Packaging Type, Material Type, Manufacturing Method, Bonding Technology, Application, and Region. Based on Packaging Type, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section. • FC BGA • FC CSP • Other Packaging Types Based on Material Type, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section. • Rigid Integrated Circuit Substrate • Flex Integrated Circuit Substrate • Ceramic Integrated Circuit Substrate By Manufacturing Method, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section. • Subtraction Process (SP) • Addition Process (AP) • Modified Semi-additive Process (MSAP) By Bonding Technology, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section. • Wire Bonding • FC Bonding • Tape Automated Bonding (TAB) By Application, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2022-2031 included in each section. • Mobile and Consumer Electronics • Automotive and Transportation • IT and Telecom • Other Applications Geographically, the following regions together with the listed national/local markets are fully investigated: • North America (U.S., Canada, and Mexico) • Europe (Germany, UK, France, Spain, Italy, Netherlands, Rest of Europe; Rest of Europe is further segmented into Russia, Switzerland, Poland, Sweden, Belgium, Austria, Ireland, Norway, Denmark, and Finland) • APAC (Japan, China, South Korea, Australia, Taiwan, and Rest of APAC; Rest of APAC is further segmented into Malaysia, Singapore, Indonesia, Thailand, New Zealand, Vietnam, India, and Philippines) • South America (Brazil, Chile, Argentina, Rest of South America) • MEA (UAE, Saudi Arabia, South Africa and Rest of MEA) For each aforementioned region and country, detailed analysis and data for annual revenue ($ mn) are available for 2022-2031. The breakdown of all regional markets by country and split of each national market by Packaging Type, Material Type and Application over the forecast years are also included. The report also covers the current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players. Selected Key Players: ASE Group AT&S Austria Technologie & Systemtechnik AG Fujitsu Ltd. IBIDEN Co., Ltd. Kinsus Interconnect Technology Corp. Korea Circuit Co., Ltd. KYOCERA Corporation LG Innotek Co., Ltd. Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation) Shenzhen Fastprint Circuit Tech Shinko Electric Industries Co., Ltd. Siliconware Precision Industries Co., Ltd. STATS ChipPAC Pte. Ltd. (JCET GROUP CO. LTD) TTM Technologies Inc. Unimicron Corporation Zhen Ding Technology Holding Ltd. Zhuhai ACCESS Semiconductor (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)

1 Introduction 10

1.1 Industry Definition and Research Scope 10

1.1.1 Industry Definition 10

1.1.2 Research Scope 11

1.2 Research Methodology 14

1.2.1 Overview of Market Research Methodology 14

1.2.2 Market Assumption 15

1.2.3 Secondary Data 15

1.2.4 Primary Data 15

1.2.5 Data Filtration and Model Design 16

1.2.6 Market Size/Share Estimation 17

1.2.7 Research Limitations 18

1.3 Executive Summary 19

2 Market Overview and Dynamics 22

2.1 Market Size and Forecast 22

2.1.1 Impact of COVID-19 on World Economy 24

2.1.2 Impact of COVID-19 on the Market 27

2.1.3 Impact of Russia-Ukraine Conflict: War Slows Economic Recovery 29

2.2 Major Growth Drivers 33

2.3 Market Restraints and Challenges 38

2.4 Emerging Opportunities and Market Trends 41

2.5 Porter’s Fiver Forces Analysis 45

3 Segmentation of Global Market by Packaging Type 49

3.1 Market Overview by Packaging Type 49

3.2 FC BGA 51

3.3 FC CSP 52

3.4 Other Packaging Types 53

4 Segmentation of Global Market by Material Type 54

4.1 Market Overview by Material Type 54

4.2 Rigid Integrated Circuit Substrate 56

4.3 Flex Integrated Circuit Substrate 57

4.4 Ceramic Integrated Circuit Substrate 58

5 Segmentation of Global Market by Manufacturing Method 59

5.1 Market Overview by Manufacturing Method 59

5.2 Subtraction Process (SP) 61

5.3 Addition Process (AP) 62

5.4 Modified Semi-additive Process (MSAP) 63

6 Segmentation of Global Market by Bonding Technology 64

6.1 Market Overview by Bonding Technology 64

6.2 Wire Bonding 66

6.3 FC Bonding 68

6.4 Tape Automated Bonding (TAB) 70

7 Segmentation of Global Market by Application 71

7.1 Market Overview by Application 71

7.2 Mobile and Consumer Electronics 73

7.3 Automotive and Transportation 74

7.4 IT and Telecom 75

7.5 Other Applications 76

8 Segmentation of Global Market by Region 77

8.1 Geographic Market Overview 2021-2031 77

8.2 North America Market 2021-2031 by Country 81

8.2.1 Overview of North America Market 81

8.2.2 U.S. 85

8.2.3 Canada 88

8.2.4 Mexico 90

8.3 European Market 2021-2031 by Country 92

8.3.1 Overview of European Market 92

8.3.2 Germany 96

8.3.3 U.K. 98

8.3.4 France 100

8.3.5 Spain 102

8.3.6 Italy 104

8.3.7 Netherlands 106

8.3.8 Rest of European Market 108

8.4 Asia-Pacific Market 2021-2031 by Country/Region 110

8.4.1 Overview of Asia-Pacific Market 110

8.4.2 Japan 114

8.4.3 China 117

8.4.4 Australia 119

8.4.5 Taiwan 121

8.4.6 South Korea 123

8.4.7 Rest of APAC Region 125

8.5 South America Market 2021-2031 by Country 127

8.5.1 Argentina 130

8.5.2 Brazil 132

8.5.3 Chile 134

8.5.4 Rest of South America Market 136

8.6 MEA Market 2021-2031 by Country 137

8.6.1 UAE 140

8.6.2 Saudi Arabia 142

8.6.3 South Africa 144

8.6.4 Other National Markets 146

9 Competitive Landscape 147

9.1 Overview of Key Vendors 147

9.2 New Product Launch, Partnership, Investment, and M&A 150

9.3 Company Profiles 151

ASE Group 151

AT&S Austria Technologie & Systemtechnik AG 153

Fujitsu Ltd. 156

IBIDEN Co., Ltd. 160

Kinsus Interconnect Technology Corp. 162

Korea Circuit Co., Ltd. 164

KYOCERA Corporation 165

LG Innotek Co., Ltd. 168

Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation) 169

Shenzhen Fastprint Circuit Tech 170

Shinko Electric Industries Co., Ltd. 171

Siliconware Precision Industries Co., Ltd. 174

STATS ChipPAC Pte. Ltd. (JCET GROUP CO. LTD) 176

TTM Technologies Inc. 179

Unimicron Corporation 182

Zhen Ding Technology Holding Ltd. 185

Zhuhai ACCESS Semiconductor 186

RELATED REPORTS 187

List of Tables:

Table 1. Snapshot of Global Advanced IC Substrates Market in Balanced Perspective, 2021-2031 20
Table 2. World Economic Outlook, 2021-2031 25
Table 3. World Economic Outlook, 2021-2023 26
Table 4. Scenarios for Economic Impact of Ukraine Crisis 30
Table 5. World Semiconductor Market, 2021-2031, $ bn 36
Table 6. Main Product Trends and Market Opportunities in Global Advanced IC Substrates Market 41
Table 7. Global Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 49
Table 8. Global Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 54
Table 9. Global Advanced IC Substrates Market by Manufacturing Method, 2021-2031, $ mn 59
Table 10. Global Advanced IC Substrates Market by Bonding Technology, 2021-2031, $ mn 64
Table 11. Global Advanced IC Substrates Market by Application, 2021-2031, $ mn 71
Table 12. Global Advanced IC Substrates Market by Region, 2021-2031, $ mn 78
Table 13. Leading National Advanced IC Substrates Market, 2022 and 2031, $ mn 80
Table 14. North America Advanced IC Substrates Market by Country, 2021-2031, $ mn 83
Table 15. U.S. Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 87
Table 16. U.S. Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 87
Table 17. U.S. Advanced IC Substrates Market by Application, 2021-2031, $ mn 87
Table 18. Canada Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 89
Table 19. Canada Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 89
Table 20. Canada Advanced IC Substrates Market by Application, 2021-2031, $ mn 89
Table 21. Mexico Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 91
Table 22. Mexico Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 91
Table 23. Mexico Advanced IC Substrates Market by Application, 2021-2031, $ mn 91
Table 24. Europe Advanced IC Substrates Market by Country, 2021-2031, $ mn 95
Table 25. Germany Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 97
Table 26. Germany Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 97
Table 27. Germany Advanced IC Substrates Market by Application, 2021-2031, $ mn 97
Table 28. U.K. Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 99
Table 29. U.K. Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 99
Table 30. U.K. Advanced IC Substrates Market by Application, 2021-2031, $ mn 99
Table 31. France Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 101
Table 32. France Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 101
Table 33. France Advanced IC Substrates Market by Application, 2021-2031, $ mn 101
Table 34. Spain Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 103
Table 35. Spain Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 103
Table 36. Spain Advanced IC Substrates Market by Application, 2021-2031, $ mn 103
Table 37. Italy Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 105
Table 38. Italy Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 105
Table 39. Italy Advanced IC Substrates Market by Application, 2021-2031, $ mn 105
Table 40. Netherlands Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 107
Table 41. Netherlands Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 107
Table 42. Netherlands Advanced IC Substrates Market by Application, 2021-2031, $ mn 107
Table 43. Advanced IC Substrates Market in Rest of Europe by Country, 2021-2031, $ mn 109
Table 44. APAC Advanced IC Substrates Market by Country/Region, 2021-2031, $ mn 112
Table 45. Japan Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 116
Table 46. Japan Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 116
Table 47. Japan Advanced IC Substrates Market by Application, 2021-2031, $ mn 116
Table 48. China Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 118
Table 49. China Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 118
Table 50. China Advanced IC Substrates Market by Application, 2021-2031, $ mn 118
Table 51. Australia Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 120
Table 52. Australia Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 120
Table 53. Australia Advanced IC Substrates Market by Application, 2021-2031, $ mn 120
Table 54. Taiwan Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 122
Table 55. Taiwan Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 122
Table 56. Taiwan Advanced IC Substrates Market by Application, 2021-2031, $ mn 122
Table 57. South Korea Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 124
Table 58. South Korea Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 124
Table 59. South Korea Advanced IC Substrates Market by Application, 2021-2031, $ mn 124
Table 60. Advanced IC Substrates Market in Rest of APAC by Country/Region, 2021-2031, $ mn 126
Table 61. South America Advanced IC Substrates Market by Country, 2021-2031, $ mn 129
Table 62. Argentina Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 131
Table 63. Argentina Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 131
Table 64. Argentina Advanced IC Substrates Market by Application, 2021-2031, $ mn 131
Table 65. Brazil Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 133
Table 66. Brazil Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 133
Table 67. Brazil Advanced IC Substrates Market by Application, 2021-2031, $ mn 133
Table 68. Chile Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 135
Table 69. Chile Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 135
Table 70. Chile Advanced IC Substrates Market by Application, 2021-2031, $ mn 135
Table 71. MEA Advanced IC Substrates Market by Country, 2021-2031, $ mn 139
Table 72. UAE Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 141
Table 73. UAE Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 141
Table 74. UAE Advanced IC Substrates Market by Application, 2021-2031, $ mn 141
Table 75. Saudi Arabia Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 143
Table 76. Saudi Arabia Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 143
Table 77. Saudi Arabia Advanced IC Substrates Market by Application, 2021-2031, $ mn 143
Table 78. South Africa Advanced IC Substrates Market by Packaging Type, 2021-2031, $ mn 145
Table 79. South Africa Advanced IC Substrates Market by Material Type, 2021-2031, $ mn 145
Table 80. South Africa Advanced IC Substrates Market by Application, 2021-2031, $ mn 145
Table 81. ASE Group: Company Snapshot 151
Table 82. ASE Group: Business Segmentation 152
Table 83. ASE Group: Product Portfolio 152
Table 84. AT&S Austria Technologie & Systemtechnik AG: Company Snapshot 153
Table 85. AT&S Austria Technologie & Systemtechnik AG: Breakdown of Revenue by Business Segment 154
Table 86. Fujitsu Limited: Company Snapshot 156
Table 87. Fujitsu Limited: Business Segmentation and Share 157
Table 88. Fujitsu Limited: Revenue Distribution by Region in 2021 158
Table 89. IBIDEN Co., Ltd.: Company Snapshot 160
Table 90. IBIDEN Co., Ltd.: Breakdown of Revenue by Business Segment 161
Table 91. Kinsus Interconnect Technology Corp..: Company Snapshot 162
Table 92. Kinsus Interconnect Technology Corp.: Breakdown of Revenue by Business Segment 163
Table 93. Korea Circuit Co., Ltd.: Company Snapshot 164
Table 94. KYOCERA Corporation: Company Snapshot 165
Table 95. KYOCERA Corporation: Breakdown of Revenue by Business Segment 166
Table 96. LG Innotek Co., Ltd.: Company Snapshot 168
Table 97. Nan Ya PCB Co., Ltd.: Company Snapshot 169
Table 98. Shenzhen Fastprint Circuit Tech: Company Snapshot 170
Table 99. Shinko Electric Industries Co., Ltd.: Company Snapshot 171
Table 100. Shinko Electric Industries Co., Ltd.: Breakdown of Revenue by Business Segment 172
Table 101. Siliconware Precision Industries Co., Ltd.: Company Snapshot 174
Table 102. Siliconware Precision Industries Co., Ltd.: Breakdown of Revenue by Business Segment 175
Table 103. STATS ChipPAC Pte. Ltd.: Company Snapshot 176
Table 104. STATS ChipPAC Pte. Ltd.: Breakdown of Revenue by Business Segment 177
Table 105. TTM Technologies Inc.: Company Snapshot 179
Table 106. TTM Technologies Inc.: Breakdown of Revenue by Business Segment 180
Table 107. Unimicron Corporation: Company Snapshot 182
Table 108. Unimicron Corporation: Breakdown of Revenue by Business Segment 183
Table 109. Zhen Ding Technology Holding Ltd.: Company Snapshot 185
Table 110. Zhuhai ACCESS Semiconductor: Company Snapshot 186

List of Figures:

Figure 1. Research Method Flow Chart 14
Figure 2. Bottom-up Approach and Top-down Approach for Market Estimation 17
Figure 3. Global Market Forecast in Optimistic, Conservative and Balanced Perspectives, 2022-2031 19
Figure 4. Industry Value Chain Analysis 22
Figure 5. Global Advanced IC Substrates Market, 2021-2031, $ mn 23
Figure 6. Impact of COVID-19 on Business 27
Figure 7. Primary Drivers and Impact Factors of Global Advanced IC Substrates Market 33
Figure 8. World 5G Devices Market by Value, 2019-2030, $ bn 37
Figure 9. World Autonomous Vehicle Market, 2019-2030, $ mn 37
Figure 10. Primary Restraints and Impact Factors of Global Advanced IC Substrates Market 38
Figure 11. Investment Opportunity Analysis 42
Figure 12. Porter’s Fiver Forces Analysis of Global Advanced IC Substrates Market 45
Figure 13. Breakdown of Global Advanced IC Substrates Market by Packaging Type, 2021-2031, % of Revenue 50
Figure 14. Global Addressable Market Cap in 2023-2031 by Packaging Type, Value ($ mn) and Share (%) 50
Figure 15. Global Advanced IC Substrates Market by Packaging Type: FC BGA, 2021-2031, $ mn 51
Figure 16. Global Advanced IC Substrates Market by Packaging Type: FC CSP, 2021-2031, $ mn 52
Figure 17. Global Advanced IC Substrates Market by Packaging Type: Other Packaging Types, 2021-2031, $ mn 53
Figure 18. Breakdown of Global Advanced IC Substrates Market by Material Type, 2021-2031, % of Sales Revenue 55
Figure 19. Global Addressable Market Cap in 2023-2031 by Material Type, Value ($ mn) and Share (%) 55
Figure 20. Global Advanced IC Substrates Market by Material Type: Rigid Integrated Circuit Substrate, 2021-2031, $ mn 56
Figure 21. Global Advanced IC Substrates Market by Material Type: Flex Integrated Circuit Substrate, 2021-2031, $ mn 57
Figure 22. Global Advanced IC Substrates Market by Material Type: Ceramic Integrated Circuit Substrate, 2021-2031, $ mn 58
Figure 23. Breakdown of Global Advanced IC Substrates Market by Manufacturing Method, 2021-2031, % of Sales Revenue 60
Figure 24. Global Addressable Market Cap in 2023-2031 by Manufacturing Method, Value ($ mn) and Share (%) 60
Figure 25. Global Advanced IC Substrates Market by Manufacturing Method: Subtraction Process (SP), 2021-2031, $ mn 61
Figure 26. Global Advanced IC Substrates Market by Manufacturing Method: Addition Process (AP), 2021-2031, $ mn 62
Figure 27. Global Advanced IC Substrates Market by Manufacturing Method: Modified Semi-additive Process (MSAP), 2021-2031, $ mn 63
Figure 28. Breakdown of Global Advanced IC Substrates Market by Bonding Technology, 2021-2031, % of Revenue 65
Figure 29. Global Addressable Market Cap in 2023-2031 by Bonding Technology, Value ($ mn) and Share (%) 65
Figure 30. Global Advanced IC Substrates Market by Bonding Technology: Wire Bonding, 2021-2031, $ mn 66
Figure 31. Picture of Wire Bonding Illustrated in a DIP Package 67
Figure 32. Global Advanced IC Substrates Market by Bonding Technology: FC Bonding, 2021-2031, $ mn 68
Figure 33. Picture of a Flipped Chip (IC) on a Passive Substrate 69
Figure 34. Global Advanced IC Substrates Market by Bonding Technology: Tape Automated Bonding (TAB), 2021-2031, $ mn 70
Figure 35. Breakdown of Global Advanced IC Substrates Market by Application, 2021-2031, % of Revenue 72
Figure 36. Global Addressable Market Cap in 2023-2031 by Application, Value ($ mn) and Share (%) 72
Figure 37. Global Advanced IC Substrates Market by Application: Mobile and Consumer Electronics, 2021-2031, $ mn 73
Figure 38. Global Advanced IC Substrates Market by Application: Automotive and Transportation, 2021-2031, $ mn 74
Figure 39. Global Advanced IC Substrates Market by Application: IT and Telecom, 2021-2031, $ mn 75
Figure 40. Global Advanced IC Substrates Market by Application: Other Applications, 2021-2031, $ mn 76
Figure 41. Global Market Snapshot by Region 77
Figure 42. Geographic Spread of Worldwide Advanced IC Substrates Market, 2021-2031, % of Sales Revenue 78
Figure 43. Global Addressable Market Cap in 2023-2031 by Region, Value ($ mn) and Share (%) 79
Figure 44. North American Advanced IC Substrates Market, 2021-2031, $ mn 82
Figure 45. Breakdown of North America Advanced IC Substrates Market by Country, 2022 and 2031, % of Revenue 83
Figure 46. Contribution to North America 2023-2031 Cumulative Market by Country, Value ($ mn) and Share (%) 84
Figure 47. U.S. Advanced IC Substrates Market, 2021-2031, $ mn 86
Figure 48. Canada Advanced IC Substrates Market, 2021-2031, $ mn 88
Figure 49. Advanced IC Substrates Market in Mexico, 2021-2031, $ mn 90
Figure 50. European Advanced IC Substrates Market, 2021-2031, $ mn 93
Figure 51. Breakdown of European Advanced IC Substrates Market by Country, 2022 and 2031, % of Revenue 94
Figure 52. Contribution to Europe 2023-2031 Cumulative Market by Country, Value ($ mn) and Share (%) 95
Figure 53. Advanced IC Substrates Market in Germany, 2021-2031, $ mn 96
Figure 54. Advanced IC Substrates Market in U.K., 2021-2031, $ mn 98
Figure 55. Advanced IC Substrates Market in France, 2021-2031, $ mn 100
Figure 56. Advanced IC Substrates Market in Spain, 2021-2031, $ mn 102
Figure 57. Advanced IC Substrates Market in Italy, 2021-2031, $ mn 104
Figure 58. Advanced IC Substrates Market in Netherlands, 2021-2031, $ mn 106
Figure 59. Advanced IC Substrates Market in Rest of Europe, 2021-2031, $ mn 108
Figure 60. Asia-Pacific Advanced IC Substrates Market, 2021-2031, $ mn 111
Figure 61. Breakdown of APAC Advanced IC Substrates Market by Country/Region, 2022 and 2031, % of Revenue 111
Figure 62. Contribution to APAC 2023-2031 Cumulative Market by Country/Region, Value ($ mn) and Share (%) 113
Figure 63. Advanced IC Substrates Market in Japan, 2021-2031, $ mn 115
Figure 64. Advanced IC Substrates Market in China, 2021-2031, $ mn 117
Figure 65. Advanced IC Substrates Market in Australia, 2021-2031, $ mn 119
Figure 66. Advanced IC Substrates Market in Taiwan, 2021-2031, $ mn 121
Figure 67. Advanced IC Substrates Market in South Korea, 2021-2031, $ mn 123
Figure 68. Advanced IC Substrates Market in Rest of APAC, 2021-2031, $ mn 125
Figure 69. South America Advanced IC Substrates Market, 2021-2031, $ mn 128
Figure 70. Breakdown of South America Advanced IC Substrates Market by Country, 2022 and 2031, % of Revenue 128
Figure 71. Contribution to South America 2023-2031 Cumulative Market by Country, Value ($ mn) and Share (%) 129
Figure 72. Advanced IC Substrates Market in Argentina, 2021-2031, $ mn 130
Figure 73. Advanced IC Substrates Market in Brazil, 2021-2031, $ mn 132
Figure 74. Advanced IC Substrates Market in Chile, 2021-2031, $ mn 134
Figure 75. Advanced IC Substrates Market in Rest of South America, 2021-2031, $ mn 136
Figure 76. Advanced IC Substrates Market in Middle East and Africa (MEA), 2021-2031, $ mn 138
Figure 77. Breakdown of MEA Advanced IC Substrates Market by Country, 2022 and 2031, % of Revenue 138
Figure 78. Contribution to MEA 2023-2031 Cumulative Market by Country, Value ($ mn) and Share (%) 139
Figure 79. Advanced IC Substrates Market in UAE, 2021-2031, $ mn 140
Figure 80. Advanced IC Substrates Market in Saudi Arabia, 2021-2031, $ mn 142
Figure 81. Advanced IC Substrates Market in South Africa, 2021-2031, $ mn 144
Figure 82. Growth Stage of Global Advanced IC Substrates Industry over the Forecast Period 147

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