List of Figures:
Figure 1. Research Method Flow Chart 10
Figure 2. Bottom-up Approach and Top-down Approach for Market Estimation 13
Figure 3. Asia Pacific Market Forecast in Optimistic, Conservative and Balanced Perspectives, 2021-2031 15
Figure 4. Asia Pacific Substrate-Like PCB Market, 2021-2031, $ mn 17
Figure 5. Impact of COVID-19 on Business 20
Figure 6. Primary Drivers and Impact Factors of Asia Pacific Substrate-Like PCB Market 22
Figure 7. World Smartphone Market by Value, 2017-2027, $ bn 25
Figure 8. World Smart Wearable Devices Market, 2019-2030, $ mn 25
Figure 9. Primary Restraints and Impact Factors of Asia Pacific Substrate-Like PCB Market 26
Figure 10. Investment Opportunity Analysis 30
Figure 11. Porter’s Fiver Forces Analysis of Asia Pacific Substrate-Like PCB Market 33
Figure 12. Breakdown of Asia Pacific Substrate-Like PCB Market by Inspection Technology, 2021-2031, % of Revenue 38
Figure 13. Asia Pacific Addressable Market Cap in 2022-2031 by Inspection Technology, Value ($ mn) and Share (%) 38
Figure 14. Asia Pacific Substrate-Like PCB Market by Inspection Technology: Automated Optical Inspection (AOI), 2021-2031, $ mn 39
Figure 15. Asia Pacific Substrate-Like PCB Market by Inspection Technology: Direct Imaging (DI), 2021-2031, $ mn 40
Figure 16. Breakdown of Asia Pacific Substrate-Like PCB Market by Line/Space, 2021-2031, % of Sales Revenue 42
Figure 17. Asia Pacific Addressable Market Cap in 2022-2031 by Line/Space, Value ($ mn) and Share (%) 42
Figure 18. Asia Pacific Substrate-Like PCB Market by Line/Space: 25/25 and 30/30 ?m, 2021-2031, $ mn 43
Figure 19. Asia Pacific Substrate-Like PCB Market by Line/Space: Less than 25/25 ?m, 2021-2031, $ mn 44
Figure 20. Breakdown of Asia Pacific Substrate-Like PCB Market by Application, 2021-2031, % of Sales Revenue 46
Figure 21. Asia Pacific Addressable Market Cap in 2022-2031 by Application, Value ($ mn) and Share (%) 46
Figure 22. Asia Pacific Substrate-Like PCB Market by Application: Consumer Electronics, 2021-2031, $ mn 47
Figure 23. Asia Pacific Substrate-Like PCB Market by Application: Automotive Industry, 2021-2031, $ mn 48
Figure 24. Asia Pacific Substrate-Like PCB Market by Application: Medical Industry, 2021-2031, $ mn 49
Figure 25. Asia Pacific Substrate-Like PCB Market by Application: Industrial Use, 2021-2031, $ mn 50
Figure 26. Asia Pacific Substrate-Like PCB Market by Application: Computing and Communications, 2021-2031, $ mn 51
Figure 27. Asia Pacific Substrate-Like PCB Market by Application: Other Applications, 2021-2031, $ mn 52
Figure 28. Breakdown of APAC Substrate-Like PCB Market by Country, 2021 and 2031, % of Revenue 54
Figure 29. Contribution to APAC 2022-2031 Cumulative Market by Country, Value ($ mn) and Share (%) 55
Figure 30. Substrate-Like PCB Market in Japan, 2021-2031, $ mn 57
Figure 31. Substrate-Like PCB Market in China, 2021-2031, $ mn 59
Figure 32. Substrate-Like PCB Market in Australia, 2021-2031, $ mn 61
Figure 33. Substrate-Like PCB Market in India, 2021-2031, $ mn 63
Figure 34. Substrate-Like PCB Market in South Korea, 2021-2031, $ mn 65
Figure 35. Substrate-Like PCB Market in Rest of APAC, 2021-2031, $ mn 67
Figure 36. Growth Stage of Asia Pacific Substrate-Like PCB Industry over the Forecast Period 69
Asia Pacific substrate-like PCB (SLP) market will grow by 15.6% annually with a total addressable market cap of $ 25,000.1 million over 2022-2031, driven by SLP’s ability to enable faster transmission while simultaneously giving the manufacturers more freedom to design their product, increasing R&D activities for technological advancements, the rising prevalence of smart consumer electronics such as smartphones and wearable devices, and the growing demand for effective connectivity solutions and the growing trend of miniaturization. Highlighted with 26 tables and 36 figures, this 88-page report “Asia Pacific Substrate-Like PCB (SLP) Market 2021-2031 by Inspection Technology (AOI, DI, AOS), Line/Space (25/25 and 30/30 ?m, Less than 25/25 ?m), Application (Consumer Electronics, Automotive, Medical, Industrial, Computing and Communications, Others), and Country: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire Asia Pacific substrate-like PCB (SLP) market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2019-2021 and provides forecast from 2022 till 2031 with 2021 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) In-depth qualitative analyses include identification and investigation of the following aspects: • Market Structure • Growth Drivers • Restraints and Challenges • Emerging Product Trends & Market Opportunities • Porter’s Fiver Forces The trend and outlook of Asia Pacific market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify Asia Pacific substrate-like PCB (SLP) market in every aspect of the classification from perspectives of Inspection Technology, Line/Space, Application, and Country. Based on Inspection Technology, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • Automated Optical Inspection (AOI) • Direct Imaging (DI) • Automated Optical Shaping (AOS) Based on Line/Space, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • 25/25 and 30/30 ?m • Less than 25/25 ?m By Application, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • Consumer Electronics • Automotive Industry • Medical Industry • Industrial Use • Computing and Communications • Other Applications Geographically, the following national/local markets are fully investigated: • Japan • China • South Korea • Australia • India • Rest of APAC (further segmented into Malaysia, Singapore, Indonesia, Thailand, New Zealand, Vietnam, Taiwan, and Philippines) For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2021-2031. The breakdown of national markets by Inspection Technology, Line/Space and Application over the forecast years are also included. The report also covers current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players. Selected Key Players: Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S) China Circuit Technology Corporation Compaq Manufacturing Co., Ltd. Daeduck Electronics Co., Ltd. HannStar Board Corporation Ibiden Co., Ltd. Kinsus Interconnect Technology Corp Korea Circuit Co., Ltd. Samsung Electro-Mechanics Co., Ltd. Shenzhen Fastprint Circuit Tech Co., Ltd. Symtek Automation Asia Co., Ltd. TTM Technologies, Inc. Unimicron Technology Corp. Zhen Ding Tech. Group Technology Holding Limited (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
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