North America Advanced Packaging Market 2021-2031

North America advanced packaging market is projected to grow by 8.1% annually in the forecast period and reach $8,293.6 million by 2031, driven by the rising demand for consumer electronics, the growing demand for high-end chips, and the cost reduction and improved efficiency brought by advancing packaging. North America is also estimated to grow significantly over the forecast period owing to the development of several advanced packaging technologies such as copper hybrid bonding and wafer level packaging (WPL) and the increasing demand for IoT-connected devices, such as wearables are some of the attributes that is anticipated to drive the growth of the Advanced Packaging Market in this region. For instance, On 25th February 2021, Veeco Instruments Inc. announced plans to expand its manufacturing capabilities in San Jose, California in order to meet the increasing demand for the advanced laser annealing technology that benefits the world’s leading semiconductor technology companies. This new, SEMI-compliant facility will serve the company’s for the development and production of laser annealing and advanced packaging lithography systems for semiconductor applications.

Semiconductor packaging industry is providing advanced IC packages to develop next-generation chip designs. Traditionally, the integrated circuit industry was using traditional chip scaling and innovative architectures for new devices. In addition, there exist multi-chip packages in every phone, data center, consumer electronics, and network which drive the growth of advanced packaging as it promotes system optimization. Advance packaging promotes usage of AI, machine learning, and deep learning as it allows variety of different processing elements and memories to be coupled together using very high-speed interconnects. Therefore, enhanced operation capabilities and precise processing is lucrative for various industry verticals, such as automotive, healthcare, aerospace & defense, and industrial sector, which are now adopting advanced packaging. 

One of the key drivers of the North America advanced packaging market is the availability of compact devices with superior functionality. With the high-end technologies including artificial intelligence (AI) and IoT commanding attention of multiple industrial verticals, the demand for advanced packaging is expected to escalate amongst IDMs and foundry suppliers. The presence of several leading market players including Broadcom, Skyworks, and Qualcomm in the region will positively influence the development of the market.

Apart from the trending miniaturization of electronic devices, advanced packaging solutions offer multifarious benefits including smaller footprint, lower power consumption, and superior chip connectivity, which will also support the growth of North America market.

The north American market is also expected to grow on the account of the sweeping penetration of AI, 5G, IoT, and photonics across the region, which is attributed majorly to the Tec-savvy consumer in the country of USA and Canada. Nonetheless, the surge in miniaturization of devices is helping the embedded die packaging market gain renewed requirement. Also, the heavy Government investment in enhancing semiconductor manufacturing plants specially in the developing nations are projected to propel the growth of market. Therefore, it is predicted that during the near period the market of advanced packaging will augment more proficiently over the assess period.

Advanced packaging is a very costly process as against conventional packaging solutions used in semiconductor industry. The cost of designing and manufacturing chips at each new node is costly at certain levels. In addition, the cost of wafer fabrication is much higher due to the complexities of the ICs. Packaging of different chips and ICs with complex pattering increases the overall cost of advanced packaging and hampers its adoption.

Impact of COVID-19
The market experienced a great measure of impact from the pandemic, this effect was both negative as well as positive. The positive effect was created through the rising E-commerce adoption from the consumers in the region, accompanied by rise in consumption in electronic gadgets. On the other hand social situations like the lockdowns in different countries of the region along with trave restriction greatly affected the market in a negative way by decreasing the demand for the advanced packaging.

Highlighted with 20 tables and 38 figures, this 89-page report “North America Advanced Packaging Market 2021-2031 by Product Type (Active Packaging, Smart and Intelligent Packaging), Packaging Platform (Flip-Chip Ball Grid Array, Flip Chip CSP, Wafer Level CSP, 2.5D/3D IC, Fo-WLP, Embedded Die, Fi-WLP), End User (Consumer Electronics, IT and Telecom, Automotive and Transportation, Industrial Sector), and Country: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire North America advanced packaging market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2018-2021 and provides forecast from 2022 till 2031 with 2021 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)

In-depth qualitative analyses include identification and investigation of the following aspects:
• Market Structure
• Growth Drivers
• Restraints and Challenges
• Emerging Product Trends & Market Opportunities
• Porter’s Fiver Forces

The trend and outlook of North America market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19. The balanced (most likely) projection is used to quantify North America advanced packaging market in every aspect of the classification from perspectives of Product Type, Packaging Platform, End User, and Country.

Based on Product Type, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Active Packaging
• Smart and Intelligent Packaging

Based on Packaging Platform, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Flip-Chip Ball Grid Array
• Flip Chip CSP
• Wafer Level CSP
• 2.5D/3D Integrated Circuit
• Fan Out Wafer Level Package (Fo-WLP)
• Embedded Die
• Fan In Wafer Level Package (Fi-WLP)
• Other Packaging Platforms

By End User, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Consumer Electronics
• IT and Telecom
• Automotive and Transportation
• Industrial Sector
• Healthcare and Life Science
• Aerospace and Defense
• Other End Users

Geographically, the following national/local markets are fully investigated:
• U.S.
• Canada
• Mexico
For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2021-2031. The breakdown of the regional market by country and split of key national markets by Product Type, Packaging Platform, and End User over the forecast years are also included.

The report also covers current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players.
Selected Key Players:
Advanced Semiconductor Engineering Inc.
Amkor Technology, Inc.
Brewer Science, Inc.
Chipbond Technology Corporation
Intel Corporation
International Business Machines Corporation (IBM)
Microchip Technology, Inc.
Qualcomm Technologies, Inc.
Renesas Electronics Corporation
Samsung Electronics Co., Ltd.
STATS ChipPAC Pte. Ltd
SÜSS Microtec Se
Taiwan Semiconductor Manufacturing Company, Limited
Texas Instruments, Inc.
Universal Instruments Corporation
(Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)

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