Global Advanced Packaging Market 2021-2031

Global advanced packaging market will reach $69.17 billion by 2031, growing by 10.0% annually over 2021-2031, driven by the rising demand for consumer electronics.

Global advanced packaging market will reach $69.17 billion by 2031, growing by 10.0% annually over 2021-2031, driven by the rising demand for consumer electronics, the growing demand for high-end chips, and the cost reduction and improved efficiency brought by advancing packaging. Since the inception of the first semiconductor package in 1965, advanced packaging technologies have been evolving considerably, with several thousands of different semiconductor package types having been produced. Advanced packaging technology has evolved to minimize the cost involved and enhance the overall throughput and performance of ICs. Further, With the augmented adoption of semiconductor ICs in automobiles, the demand for advanced packaging has increased considerably in recent years. The innovation in the packaging technology is also related to an increase in the functional density of large system-on-chip solutions. As a result, the focus on heterogeneous integrations and wafer-level packages have prompted the chip industry to develop a new set of solutions, collectively known as advanced packaging. Another significant trend affecting the advanced packaging market is the increase in the size of silicon from 100 mm to 300 mm. The shift to longer diameter wafers has reduced the cost of manufacturing by 20-25%, which is expected to drive this capital into advanced packaging solutions.

Growing miniaturization of devices, increasing MEMS adoption is also helping the embedded die packaging market gain renewed demand. Though the technology is not new in the market, it has been diversified to niche applications due to high cost and low yield but has immense potential for development in the future. Advancements in Bluetooth and RF modules and the rise of WiFi-6 could further fuel investments in the technology. However, according to the Semiconductor Industry Association, strict controls and conditions position semiconductor production facilities to be more resistant to the impact of COVID-19 as a typical cleanroom have a maximum of only ten particles per cubic meter in a size range of 0.1 micrometers and the average size of the COVID-19 microbe is 0.125 micrometers. Moreover, most semiconductor operations in various countries, such as South Korea, continued uninterrupted, and chip exports grew by 9.4% in February 2020. IC packaging in the semiconductor industry has witnessed a continuous transformation in terms of characteristics, integration, and energy efficiency of the product, owing to vast demand from across various end-user verticals of the industry. The flip-chip and wafer-level packaging technologies have witnessed solid growth over the years, owing to a number of mainstream applications, primarily in high-end smartphones and tablets that are expected to meet the stringent size and power management requirements. The redistribution technology was primarily developed out of necessity to enable fan-in area array packaging (bumping) to take hold when a few chips were being designed for the area array. In the intervening years, this technology has been instrumental in developing multiple newer packaging technologies such as wafer-level packaging (WLP), fan-out packaging, and TSV-based interposers and chip stacks.

Fan-out wafer-level packaging (FOWLP) has emerged as a promising technology to meet the ever-increasing demands of consumer electronic products. The significant advantages of this type of packaging are specific features such as substrate-less package, lower thermal resistance, and higher performance due to shorter interconnects combined with direct IC connection by thin-film metallization instead of the standard wire bonds or flip-chip bumps and more moderate parasitic effects. Fan-out wafer-level packaging (FOWLP) is the latest packaging trend in the field of microelectronics. With various technological developments towards heterogeneous integration, including multiple die packaging, passive component integration in packages and redistribution layers, and other package-on-package approaches, larger substrate formats are targeted with the help of FOWLP. Hence, it is well suited for packaging a highly miniaturized energy harvester system consisting of a piezo-based harvester, a power management unit, and a supercapacitor for energy storage. The vendors in the market are also innovating their processes to expand their technology. For instance, in November 2020, Samsung presented a paper titled “Advanced RDL Interposer Packaging Technology for Heterogeneous Integration.” The company stated that it had developed an RDL Interposer package as a 2.5D package platform that was based on RDL-first fan-out wafer level package (FOWLP).

Manufacturers in the Asia-Pacific region focus on increasing their customer base in North America due to increasing demand from data centers and AI. For example, Ibiden is working toward boosting its sales from Semicon players, such as Intel, while scaling down the Flip Chip business that serves domestic smartphone markets and plans to increase the capacity in its Japanese plant by 50% by the end of 2020 by focusing on silicon bridges which connect memory semiconductors with CPUs and GPUs.?Further, China is one of the largest growing economies present with a large population, and according to statistics from China’s semiconductor association, the import of IC was witnessing an increase in the demand for the consecutive years from 2014. The Chinese government has deployed a multi-pronged strategy, which led to the support of domestic IC industry development to become the global leader in all primary IC industrial supply chain segments by 2030. This growth in the semiconductor IC industry in the region is anticipated to stimulate the demand for advanced packaging.

Highlighted with 79 tables and 74 figures, this 152-page report “Global Advanced Packaging Market 2021-2031 by Product Type (Active Packaging, Smart and Intelligent Packaging), Packaging Platform (Flip-Chip Ball Grid Array, Flip Chip CSP, Wafer Level CSP, 2.5D/3D IC, Fo-WLP, Embedded Die, Fi-WLP), End User (Consumer Electronics, IT and Telecom, Automotive and Transportation, Industrial Sector), and Region: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire global advanced packaging market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2018-2021 and provides forecast from 2022 till 2031 with 2021 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)

In-depth qualitative analyses include identification and investigation of the following aspects:
• Market Structure
• Growth Drivers
• Restraints and Challenges
• Emerging Product Trends & Market Opportunities
• Porter’s Fiver Forces

The trend and outlook of global market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19. The balanced (most likely) projection is used to quantify global advanced packaging market in every aspect of the classification from perspectives of Product Type, Packaging Platform, End User, and Region.

Based on Product Type, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Active Packaging
• Smart and Intelligent Packaging

Based on Packaging Platform, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Flip-Chip Ball Grid Array
• Flip Chip CSP
• Wafer Level CSP
• 2.5D/3D Integrated Circuit
• Fan Out Wafer Level Package (Fo-WLP)
• Embedded Die
• Fan In Wafer Level Package (Fi-WLP)
• Other Packaging Platforms

By End User, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Consumer Electronics
• IT and Telecom
• Automotive and Transportation
• Industrial Sector
• Healthcare and Life Science
• Aerospace and Defense
• Other End Users

Geographically, the following regions together with the listed national/local markets are fully investigated:
• North America (U.S., Canada, and Mexico)
• Europe (Germany, UK, France, Spain, Italy, Russia, Rest of Europe; Rest of Europe is further segmented into Netherlands, Switzerland, Poland, Sweden, Belgium, Austria, Ireland, Norway, Denmark, and Finland)
• APAC (Japan, China, South Korea, Australia, India, and Rest of APAC; Rest of APAC is further segmented into Malaysia, Singapore, Indonesia, Thailand, New Zealand, Vietnam, Taiwan, and Philippines)
• South America (Brazil, Chile, Argentina, Rest of South America)
• MEA (Turkey, Iran, South Africa, Other Nations)
For each aforementioned region and country, detailed analysis and data for annual revenue ($ mn) are available for 2021-2031. The breakdown of all regional markets by country and split of key national markets by Product Type, Packaging Platform, and End User over the forecast years are also included.

The report also covers current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players.
Selected Key Players:
Advanced Semiconductor Engineering Inc.
Amkor Technology, Inc.
Brewer Science, Inc.
Chipbond Technology Corporation
Intel Corporation
International Business Machines Corporation (IBM)
Microchip Technology, Inc.
Qualcomm Technologies, Inc.
Renesas Electronics Corporation
Samsung Electronics Co., Ltd.
STATS ChipPAC Pte. Ltd
SÜSS Microtec Se
Taiwan Semiconductor Manufacturing Company, Limited
Texas Instruments, Inc.
Universal Instruments Corporation
(Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)

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Table of Contents

  • 1 Introduction 8
  • 1.1 Industry Definition and Research Scope 8
  • 1.1.1 Industry Definition 8
  • 1.1.2 Research Scope 9
  • 1.2 Research Methodology 12
  • 1.2.1 Overview of Market Research Methodology 12
  • 1.2.2 Market Assumption 13
  • 1.2.3 Secondary Data 13
  • 1.2.4 Primary Data 13
  • 1.2.5 Data Filtration and Model Design 14
  • 1.2.6 Market Size/Share Estimation 15
  • 1.2.7 Research Limitations 16
  • 1.3 Executive Summary 17
  • 2 Market Overview and Dynamics 20
  • 2.1 Market Size and Forecast 20
  • 2.1.1 Impact of COVID-19 on World Economy 21
  • 2.1.2 Impact of COVID-19 on the Market 23
  • 2.2 Major Growth Drivers 25
  • 2.3 Market Restraints and Challenges 28
  • 2.4 Emerging Opportunities and Market Trends 31
  • 2.5 Porter’s Fiver Forces Analysis 35
  • 3 Segmentation of Global Market by Product Type 39
  • 3.1 Market Overview by Product Type 39
  • 3.2 Active Packaging 41
  • 3.3 Smart and Intelligent Packaging 42
  • 4 Segmentation of Global Market by Packaging Platform 43
  • 4.1 Market Overview by Packaging Platform 43
  • 4.2 Flip-Chip Ball Grid Array 45
  • 4.3 Flip Chip CSP 46
  • 4.4 Wafer Level CSP 47
  • 4.5 2.5D/3D Integrated Circuit 48
  • 4.6 Fan Out Wafer Level Package (Fo-WLP) 49
  • 4.7 Embedded Die 50
  • 4.8 Fan In Wafer Level Package (Fi-WLP) 51
  • 4.9 Other Packaging Platforms 52
  • 5 Segmentation of Global Market by End User 53
  • 5.1 Market Overview by End User 53
  • 5.2 Consumer Electronics 55
  • 5.3 IT and Telecom 56
  • 5.4 Automotive and Transportation 57
  • 5.5 Industrial Sector 58
  • 5.6 Healthcare and Life Science 59
  • 5.7 Aerospace and Defense 60
  • 5.8 Other End Users 61
  • 6 Segmentation of Global Market by Region 62
  • 6.1 Geographic Market Overview 2021-2031 62
  • 6.2 North America Market 2021-2031 by Country 66
  • 6.2.1 Overview of North America Market 66
  • 6.2.2 U.S. 70
  • 6.2.3 Canada 73
  • 6.2.4 Mexico 75
  • 6.3 European Market 2021-2031 by Country 77
  • 6.3.1 Overview of European Market 77
  • 6.3.2 Germany 81
  • 6.3.3 U.K. 83
  • 6.3.4 France 85
  • 6.3.5 Spain 87
  • 6.3.6 Italy 89
  • 6.3.7 Russia 91
  • 6.3.8 Rest of European Market 93
  • 6.4 Asia-Pacific Market 2021-2031 by Country 95
  • 6.4.1 Overview of Asia-Pacific Market 95
  • 6.4.2 Japan 99
  • 6.4.3 China 102
  • 6.4.4 Australia 104
  • 6.4.5 India 106
  • 6.4.6 South Korea 108
  • 6.4.7 Rest of APAC Region 110
  • 6.5 South America Market 2021-2031 by Country 112
  • 6.5.1 Argentina 115
  • 6.5.2 Brazil 117
  • 6.5.3 Chile 119
  • 6.5.4 Rest of South America Market 121
  • 6.6 MEA Market 2021-2031 by Country 122
  • 6.6.1 Turkey 125
  • 6.6.2 Iran 127
  • 6.6.3 South Africa 129
  • 6.6.4 Other National Markets 131
  • 7 Competitive Landscape 132
  • 7.1 Overview of Key Vendors 132
  • 7.2 New Product Launch, Partnership, Investment, and M&A 135
  • 7.3 Company Profiles 136
  • Advanced Semiconductor Engineering Inc. 136
  • Amkor Technology, Inc. 138
  • Brewer Science, Inc. 139
  • Chipbond Technology Corporation 140
  • Intel Corporation 141
  • International Business Machines Corporation (IBM) 142
  • Microchip Technology, Inc. 143
  • Qualcomm Technologies, Inc. 144
  • Renesas Electronics Corporation 145
  • Samsung Electronics Co., Ltd. 146
  • STATS ChipPAC Pte. Ltd 147
  • SÜSS Microtec Se 148
  • Taiwan Semiconductor Manufacturing Company, Limited 149
  • Texas Instruments, Inc. 150
  • Universal Instruments Corporation 151
  • RELATED REPORTS 152

List of Tables:

Table 1. Snapshot of Global Advanced Packaging Market in Balanced Perspective, 2021-2031 18
Table 2. World Economic Outlook, 2021-2031 22
Table 3. World Electrical and Electronics Market, 2021-2031, $ bn 27
Table 4. Main Product Trends and Market Opportunities in Global Advanced Packaging Market 31
Table 5. Global Advanced Packaging Market by Product Type, 2021-2031, $ mn 39
Table 6. Global Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 43
Table 7. Global Advanced Packaging Market by End User, 2021-2031, $ mn 53
Table 8. Global Advanced Packaging Market by Region, 2021-2031, $ mn 63
Table 9. Leading National Advanced Packaging Market, 2021 and 2031, $ mn 65
Table 10. North America Advanced Packaging Market by Country, 2021-2031, $ mn 68
Table 11. U.S. Advanced Packaging Market by Product Type, 2021-2031, $ mn 72
Table 12. U.S. Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 72
Table 13. U.S. Advanced Packaging Market by End User, 2021-2031, $ mn 72
Table 14. Canada Advanced Packaging Market by Product Type, 2021-2031, $ mn 74
Table 15. Canada Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 74
Table 16. Canada Advanced Packaging Market by End User, 2021-2031, $ mn 74
Table 17. Mexico Advanced Packaging Market by Product Type, 2021-2031, $ mn 76
Table 18. Mexico Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 76
Table 19. Mexico Advanced Packaging Market by End User, 2021-2031, $ mn 76
Table 20. Europe Advanced Packaging Market by Country, 2021-2031, $ mn 80
Table 21. Germany Advanced Packaging Market by Product Type, 2021-2031, $ mn 82
Table 22. Germany Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 82
Table 23. Germany Advanced Packaging Market by End User, 2021-2031, $ mn 82
Table 24. U.K. Advanced Packaging Market by Product Type, 2021-2031, $ mn 84
Table 25. U.K. Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 84
Table 26. U.K. Advanced Packaging Market by End User, 2021-2031, $ mn 84
Table 27. France Advanced Packaging Market by Product Type, 2021-2031, $ mn 86
Table 28. France Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 86
Table 29. France Advanced Packaging Market by End User, 2021-2031, $ mn 86
Table 30. Spain Advanced Packaging Market by Product Type, 2021-2031, $ mn 88
Table 31. Spain Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 88
Table 32. Spain Advanced Packaging Market by End User, 2021-2031, $ mn 88
Table 33. Italy Advanced Packaging Market by Product Type, 2021-2031, $ mn 90
Table 34. Italy Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 90
Table 35. Italy Advanced Packaging Market by End User, 2021-2031, $ mn 90
Table 36. Russia Advanced Packaging Market by Product Type, 2021-2031, $ mn 92
Table 37. Russia Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 92
Table 38. Russia Advanced Packaging Market by End User, 2021-2031, $ mn 92
Table 39. Advanced Packaging Market in Rest of Europe by Country, 2021-2031, $ mn 94
Table 40. APAC Advanced Packaging Market by Country, 2021-2031, $ mn 97
Table 41. Japan Advanced Packaging Market by Product Type, 2021-2031, $ mn 101
Table 42. Japan Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 101
Table 43. Japan Advanced Packaging Market by End User, 2021-2031, $ mn 101
Table 44. China Advanced Packaging Market by Product Type, 2021-2031, $ mn 103
Table 45. China Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 103
Table 46. China Advanced Packaging Market by End User, 2021-2031, $ mn 103
Table 47. Australia Advanced Packaging Market by Product Type, 2021-2031, $ mn 105
Table 48. Australia Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 105
Table 49. Australia Advanced Packaging Market by End User, 2021-2031, $ mn 105
Table 50. India Advanced Packaging Market by Product Type, 2021-2031, $ mn 107
Table 51. India Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 107
Table 52. India Advanced Packaging Market by End User, 2021-2031, $ mn 107
Table 53. South Korea Advanced Packaging Market by Product Type, 2021-2031, $ mn 109
Table 54. South Korea Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 109
Table 55. South Korea Advanced Packaging Market by End User, 2021-2031, $ mn 109
Table 56. Advanced Packaging Market in Rest of APAC by Country/Region, 2021-2031, $ mn 111
Table 57. South America Advanced Packaging Market by Country, 2021-2031, $ mn 114
Table 58. Argentina Advanced Packaging Market by Product Type, 2021-2031, $ mn 116
Table 59. Argentina Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 116
Table 60. Argentina Advanced Packaging Market by End User, 2021-2031, $ mn 116
Table 61. Brazil Advanced Packaging Market by Product Type, 2021-2031, $ mn 118
Table 62. Brazil Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 118
Table 63. Brazil Advanced Packaging Market by End User, 2021-2031, $ mn 118
Table 64. Chile Advanced Packaging Market by Product Type, 2021-2031, $ mn 120
Table 65. Chile Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 120
Table 66. Chile Advanced Packaging Market by End User, 2021-2031, $ mn 120
Table 67. MEA Advanced Packaging Market by Country, 2021-2031, $ mn 124
Table 68. Turkey Advanced Packaging Market by Product Type, 2021-2031, $ mn 126
Table 69. Turkey Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 126
Table 70. Turkey Advanced Packaging Market by End User, 2021-2031, $ mn 126
Table 71. Iran Advanced Packaging Market by Product Type, 2021-2031, $ mn 128
Table 72. Iran Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 128
Table 73. Iran Advanced Packaging Market by End User, 2021-2031, $ mn 128
Table 74. South Africa Advanced Packaging Market by Product Type, 2021-2031, $ mn 130
Table 75. South Africa Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 130
Table 76. South Africa Advanced Packaging Market by End User, 2021-2031, $ mn 130
Table 77. Advanced Semiconductor Engineering Inc.: Company Snapshot 136
Table 78. Advanced Semiconductor Engineering Inc.: Business Segmentation 137
Table 79. Advanced Semiconductor Engineering Inc.: Product Portfolio 137

List of Figures:

Figure 1. Research Method Flow Chart 12
Figure 2. Bottom-up Approach and Top-down Approach for Market Estimation 15
Figure 3. Global Market Forecast in Optimistic, Conservative and Balanced Perspectives, 2021-2031 17
Figure 4. Global Advanced Packaging Market, 2021-2031, $ mn 20
Figure 5. Impact of COVID-19 on Business 23
Figure 6. Primary Drivers and Impact Factors of Global Advanced Packaging Market 25
Figure 7. Primary Restraints and Impact Factors of Global Advanced Packaging Market 28
Figure 8. Investment Opportunity Analysis 32
Figure 9. Porter’s Fiver Forces Analysis of Global Advanced Packaging Market 35
Figure 10. Breakdown of Global Advanced Packaging Market by Product Type, 2021-2031, % of Revenue 40
Figure 11. Global Addressable Market Cap in 2022-2031 by Product Type, Value ($ mn) and Share (%) 40
Figure 12. Global Advanced Packaging Market by Product Type: Active Packaging, 2021-2031, $ mn 41
Figure 13. Global Advanced Packaging Market by Product Type: Smart and Intelligent Packaging, 2021-2031, $ mn 42
Figure 14. Breakdown of Global Advanced Packaging Market by Packaging Platform, 2021-2031, % of Sales Revenue 44
Figure 15. Global Addressable Market Cap in 2022-2031 by Packaging Platform, Value ($ mn) and Share (%) 44
Figure 16. Global Advanced Packaging Market by Packaging Platform: Flip-Chip Ball Grid Array, 2021-2031, $ mn 45
Figure 17. Global Advanced Packaging Market by Packaging Platform: Flip Chip CSP, 2021-2031, $ mn 46
Figure 18. Global Advanced Packaging Market by Packaging Platform: Wafer Level CSP, 2021-2031, $ mn 47
Figure 19. Global Advanced Packaging Market by Packaging Platform: 2.5D/3D Integrated Circuit, 2021-2031, $ mn 48
Figure 20. Global Advanced Packaging Market by Packaging Platform: Fan Out Wafer Level Package (Fo-WLP), 2021-2031, $ mn 49
Figure 21. Global Advanced Packaging Market by Packaging Platform: Embedded Die, 2021-2031, $ mn 50
Figure 22. Global Advanced Packaging Market by Packaging Platform: Fan In Wafer Level Package (Fi-WLP), 2021-2031, $ mn 51
Figure 23. Global Advanced Packaging Market by Packaging Platform: Other Packaging Platforms, 2021-2031, $ mn 52
Figure 24. Breakdown of Global Advanced Packaging Market by End User, 2021-2031, % of Sales Revenue 54
Figure 25. Global Addressable Market Cap in 2022-2031 by End User, Value ($ mn) and Share (%) 54
Figure 26. Global Advanced Packaging Market by End User: Consumer Electronics, 2021-2031, $ mn 55
Figure 27. Global Advanced Packaging Market by End User: IT and Telecom, 2021-2031, $ mn 56
Figure 28. Global Advanced Packaging Market by End User: Automotive and Transportation, 2021-2031, $ mn 57
Figure 29. Global Advanced Packaging Market by End User: Industrial Sector, 2021-2031, $ mn 58
Figure 30. Global Advanced Packaging Market by End User: Healthcare and Life Science, 2021-2031, $ mn 59
Figure 31. Global Advanced Packaging Market by End User: Aerospace and Defense, 2021-2031, $ mn 60
Figure 32. Global Advanced Packaging Market by End User: Other End Users, 2021-2031, $ mn 61
Figure 33. Global Market Snapshot by Region 62
Figure 34. Geographic Spread of Worldwide Advanced Packaging Market, 2021-2031, % of Sales Revenue 63
Figure 35. Global Addressable Market Cap in 2022-2031 by Region, Value ($ mn) and Share (%) 64
Figure 36. North American Advanced Packaging Market, 2021-2031, $ mn 67
Figure 37. Breakdown of North America Advanced Packaging Market by Country, 2021 and 2031, % of Revenue 68
Figure 38. Contribution to North America 2022-2031 Cumulative Market by Country, Value ($ mn) and Share (%) 69
Figure 39. U.S. Advanced Packaging Market, 2021-2031, $ mn 71
Figure 40. Canada Advanced Packaging Market, 2021-2031, $ mn 73
Figure 41. Advanced Packaging Market in Mexico, 2021-2031, $ mn 75
Figure 42. European Advanced Packaging Market, 2021-2031, $ mn 78
Figure 43. Breakdown of European Advanced Packaging Market by Country, 2021 and 2031, % of Revenue 79
Figure 44. Contribution to Europe 2022-2031 Cumulative Market by Country, Value ($ mn) and Share (%) 80
Figure 45. Advanced Packaging Market in Germany, 2021-2031, $ mn 81
Figure 46. Advanced Packaging Market in U.K., 2021-2031, $ mn 83
Figure 47. Advanced Packaging Market in France, 2021-2031, $ mn 85
Figure 48. Advanced Packaging Market in Spain, 2021-2031, $ mn 87
Figure 49. Advanced Packaging Market in Italy, 2021-2031, $ mn 89
Figure 50. Advanced Packaging Market in Russia, 2021-2031, $ mn 91
Figure 51. Advanced Packaging Market in Rest of Europe, 2021-2031, $ mn 93
Figure 52. Asia-Pacific Advanced Packaging Market, 2021-2031, $ mn 96
Figure 53. Breakdown of APAC Advanced Packaging Market by Country, 2021 and 2031, % of Revenue 96
Figure 54. Contribution to APAC 2022-2031 Cumulative Market by Country, Value ($ mn) and Share (%) 98
Figure 55. Advanced Packaging Market in Japan, 2021-2031, $ mn 100
Figure 56. Advanced Packaging Market in China, 2021-2031, $ mn 102
Figure 57. Advanced Packaging Market in Australia, 2021-2031, $ mn 104
Figure 58. Advanced Packaging Market in India, 2021-2031, $ mn 106
Figure 59. Advanced Packaging Market in South Korea, 2021-2031, $ mn 108
Figure 60. Advanced Packaging Market in Rest of APAC, 2021-2031, $ mn 110
Figure 61. South America Advanced Packaging Market, 2021-2031, $ mn 113
Figure 62. Breakdown of South America Advanced Packaging Market by Country, 2021 and 2031, % of Revenue 113
Figure 63. Contribution to South America 2022-2031 Cumulative Market by Country, Value ($ mn) and Share (%) 114
Figure 64. Advanced Packaging Market in Argentina, 2021-2031, $ mn 115
Figure 65. Advanced Packaging Market in Brazil, 2021-2031, $ mn 117
Figure 66. Advanced Packaging Market in Chile, 2021-2031, $ mn 119
Figure 67. Advanced Packaging Market in Rest of South America, 2021-2031, $ mn 121
Figure 68. Advanced Packaging Market in Middle East and Africa (MEA), 2021-2031, $ mn 123
Figure 69. Breakdown of MEA Advanced Packaging Market by Country, 2021 and 2031, % of Revenue 123
Figure 70. Contribution to MEA 2022-2031 Cumulative Market by Country, Value ($ mn) and Share (%) 124
Figure 71. Advanced Packaging Market in Turkey, 2021-2031, $ mn 125
Figure 72. Advanced Packaging Market in Iran, 2021-2031, $ mn 127
Figure 73. Advanced Packaging Market in South Africa, 2021-2031, $ mn 129
Figure 74. Growth Stage of Global Advanced Packaging Industry over the Forecast Period 132

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