Global Multilayer Printed-wiring Board Market Growth 2024-2030
Multilayer Printed-wiring Board market expands from US$28.84 billion in 2023 to US$35.74 billion by 2030, with a 3.1% CAGR, due to increasing demand in the downstream market.
The unassuming multilayer printed circuit board (MLPCB) plays a fundamental role in modern electronics. Imagine a microscopic city built layer by layer, with each level bustling with electrical connections. These intricate boards, essentially sandwiches of conductive layers laminated together with insulating materials, serve as the foundation for countless devices, from smartphones and laptops to medical equipment and industrial automation systems. They provide the crucial physical infrastructure that allows electronic components to communicate with each other, carrying signals and power throughout the device.
The number of layers in an MLPCB can vary depending on the complexity of the device it is intended for. Simple devices like calculators might only require a few layers, while high-end smartphones or advanced medical equipment can contain dozens of intricately interconnected layers. The fabrication process for these boards is incredibly precise, involving multiple steps of photolithography, etching, and lamination to ensure precise connections and electrical isolation between the various layers.
According to our publisher’s latest study, the global Multilayer Printed-wiring Board market size was valued at US$ 28840 million in 2023. With growing demand in downstream market, the Multilayer Printed-wiring Board is forecast to a readjusted size of US$ 35740 million by 2030 with a CAGR of 3.1% during review period.
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The research report highlights the growth potential of the global Multilayer Printed-wiring Board market. Multilayer Printed-wiring Board are expected to show stable growth in the future market. However, product differentiation, reducing costs, and supply chain optimization remain crucial for the widespread adoption of Multilayer Printed-wiring Board. Market players need to invest in research and development, forge strategic partnerships, and align their offerings with evolving consumer preferences to capitalize on the immense opportunities presented by the Multilayer Printed-wiring Board market.
Multilayer PCB is made up of three or more conductive layers(copper foil layer), these layers are pressed together and form multilayer PCB. Copper foil layer is bonded together by PP(prepreg), Multilayer PCB is one of the most complex types in printed circuit board.
Global Multilayer Printed-wiring Board main players include Tripod, Nippon Mektron, Zhen Ding Technology, Unimicron, Shennan, TPT, etc., totally accounting for about 11% of market. China is the largest market of Multilayer Printed-wiring Board, with a share over 60%. As for the types of products, it can be divided into Layer 4-6, Layer 8-10 and Layer 10+. The most common product is Layer 4-6, with a share over 64%. In terms of applications, it is widely used in consumer electronics, communications, computer related industry, automotive industry and others. The most application is communications, with a share over 31%.
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Key Features:
The report on Multilayer Printed-wiring Board market reflects various aspects and provide valuable insights into the industry.
Market Size and Growth: The research report provide an overview of the current size and growth of the Multilayer Printed-wiring Board market. It may include historical data, market segmentation by Type (e.g., Layer 4-6, Layer 8-10), and regional breakdowns.
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Market Drivers and Challenges: The report can identify and analyse the factors driving the growth of the Multilayer Printed-wiring Board market, such as government regulations, environmental concerns, technological advancements, and changing consumer preferences. It can also highlight the challenges faced by the industry, including infrastructure limitations, range anxiety, and high upfront costs.
Market Dynamics in Global Multilayer Printed-Circuit Boards (MLPCBs)
Market Drivers:
• Miniaturization and Functionality: The relentless drive for smaller, more powerful electronic devices necessitates high-density interconnects that MLPCBs excel at providing.
• Booming End-Use Industries: The growth of sectors like consumer electronics, automotive electronics (connected cars), telecommunications (5G infrastructure), and computing (high-performance computing) fuels demand for MLPCBs.
Market Trends:
• Technological Advancements: Continuous advancements in materials, fabrication processes (e.g., high-density laser drilling), and miniaturization techniques are pushing the boundaries of MLPCB capabilities.
• Focus on High-Performance and Reliability: The increasing complexity of electronic devices necessitates MLPCBs with improved electrical performance, thermal management, and signal integrity.
Market Challenges:
• Geopolitical Tensions: Trade wars and disruptions in global supply chains can impact raw material availability and production costs for MLPCBs.
• Environmental Concerns: The electronics industry faces growing pressure to minimize its environmental footprint, requiring MLPCB manufacturers to adopt sustainable practices and materials.
Competitive Landscape: The research report provides analysis of the competitive landscape within the Multilayer Printed-wiring Board market. It includes profiles of key players, their market share, strategies, and product offerings. The report can also highlight emerging players and their potential impact on the market.
Technological Developments: The research report can delve into the latest technological developments in the Multilayer Printed-wiring Board industry. This include advancements in Multilayer Printed-wiring Board technology, Multilayer Printed-wiring Board new entrants, Multilayer Printed-wiring Board new investment, and other innovations that are shaping the future of Multilayer Printed-wiring Board.
• High-Frequency Materials: New materials with superior electrical properties allow for faster signal transmission, essential for high-speed computing and communication devices.
• Additive Manufacturing Integration: 3D printing technologies are being explored for rapid prototyping and potentially personalized PCB fabrication in the future.
Downstream Procumbent Preference: The report can shed light on customer procumbent behaviour and adoption trends in the Multilayer Printed-wiring Board market. It includes factors influencing customer ' purchasing decisions, preferences for Multilayer Printed-wiring Board product.
Government Policies and Incentives: The research report analyse the impact of government policies and incentives on the Multilayer Printed-wiring Board market. This may include an assessment of regulatory frameworks, subsidies, tax incentives, and other measures aimed at promoting Multilayer Printed-wiring Board market. The report also evaluates the effectiveness of these policies in driving market growth.
Environmental Impact and Sustainability: The research report assess the environmental impact and sustainability aspects of the Multilayer Printed-wiring Board market.
Market Forecasts and Future Outlook: Based on the analysis conducted, the research report provide market forecasts and outlook for the Multilayer Printed-wiring Board industry. This includes projections of market size, growth rates, regional trends, and predictions on technological advancements and policy developments.
• Growth Trajectory: The market is expected to maintain a steady growth trajectory, driven by the ever-increasing demand for miniaturization, higher functionality, and faster processing speeds in electronic devices.
• Emerging Technologies: The rise of technologies like Artificial Intelligence (AI), 5G networks, Internet of Things (IoT), and autonomous vehicles will necessitate advanced PCBs with complex functionalities, propelling MLPCB market growth.
• Geographic Expansion: While Asia Pacific currently dominates the market, regions like North America and Europe are expected to witness significant growth due to continuous technological advancements and rising domestic electronics production.
Recommendations and Opportunities: The report conclude with recommendations for industry stakeholders, policymakers, and investors. It highlights potential opportunities for market players to capitalize on emerging trends, overcome challenges, and contribute to the growth and development of the Multilayer Printed-wiring Board market.
• Miniaturization and Complexity: The relentless drive for smaller, more powerful electronic devices necessitates high-density interconnects that ML-PCBs excel at providing.
• 5G and Beyond: The rollout of 5G technology and future advancements demand high-speed data transmission, which ML-PCBs with their improved signal integrity can facilitate.
• Artificial Intelligence (AI) and Internet of Things (IoT): The burgeoning fields of AI and IoT rely on complex electronic devices that heavily utilize ML-PCBs due to their ability to handle intricate circuitry.
Market Segmentation:
Multilayer Printed-wiring Board market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value.
Segmentation by type
Layer 4-6
Layer 8-10
Layer 10+
Segmentation by application
Consumer Electronics
Communications
Computer Related Industry
Automotive Industry
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Nippon Mektron
Zhen Ding Technology
Unimicron
Young Poong Group
SEMCO
Ibiden
Tripod
TTM Technologies
Sumitomo Electric SEI
Daeduck Group
Nan Ya PCB
Compeq
HannStar Board
LG Innotek
AT&S
Meiko
WUS
TPT
Chin-Poon
Shennan
Key Questions Addressed in this Report
What is the 10-year outlook for the global Multilayer Printed-wiring Board market?
What factors are driving Multilayer Printed-wiring Board market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Multilayer Printed-wiring Board market opportunities vary by end market size?
How does Multilayer Printed-wiring Board break out type, application?
Table of Contents
1 Scope of the Report
1.1 Market Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 Market Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 Market Estimation Caveats
2 Executive Summary
2.1 World Market Overview
2.1.1 Global Multilayer Printed-wiring Board Annual Sales 2019-2030
2.1.2 World Current & Future Analysis for Multilayer Printed-wiring Board by Geographic Region, 2019, 2023 & 2030
2.1.3 World Current & Future Analysis for Multilayer Printed-wiring Board by Country/Region, 2019, 2023 & 2030
2.2 Multilayer Printed-wiring Board Segment by Type
2.2.1 Layer 4-6
2.2.2 Layer 8-10
2.2.3 Layer 10+
2.3 Multilayer Printed-wiring Board Sales by Type
2.3.1 Global Multilayer Printed-wiring Board Sales Market Share by Type (2019-2024)
2.3.2 Global Multilayer Printed-wiring Board Revenue and Market Share by Type (2019-2024)
2.3.3 Global Multilayer Printed-wiring Board Sale Price by Type (2019-2024)
2.4 Multilayer Printed-wiring Board Segment by Application
2.4.1 Consumer Electronics
2.4.2 Communications
2.4.3 Computer Related Industry
2.4.4 Automotive Industry
2.4.5 Others
2.5 Multilayer Printed-wiring Board Sales by Application
2.5.1 Global Multilayer Printed-wiring Board Sale Market Share by Application (2019-2024)
2.5.2 Global Multilayer Printed-wiring Board Revenue and Market Share by Application (2019-2024)
2.5.3 Global Multilayer Printed-wiring Board Sale Price by Application (2019-2024)
3 Global Multilayer Printed-wiring Board by Company
3.1 Global Multilayer Printed-wiring Board Breakdown Data by Company
3.1.1 Global Multilayer Printed-wiring Board Annual Sales by Company (2019-2024)
3.1.2 Global Multilayer Printed-wiring Board Sales Market Share by Company (2019-2024)
3.2 Global Multilayer Printed-wiring Board Annual Revenue by Company (2019-2024)
3.2.1 Global Multilayer Printed-wiring Board Revenue by Company (2019-2024)
3.2.2 Global Multilayer Printed-wiring Board Revenue Market Share by Company (2019-2024)
3.3 Global Multilayer Printed-wiring Board Sale Price by Company
3.4 Key Manufacturers Multilayer Printed-wiring Board Producing Area Distribution, Sales Area, Product Type
3.4.1 Key Manufacturers Multilayer Printed-wiring Board Product Location Distribution
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