List of Figures:
Figure 1. Research Method Flow Chart 11
Figure 2. Bottom-up Approach and Top-down Approach for Market Estimation 14
Figure 3. Asia Pacific Market Forecast in Optimistic, Conservative and Balanced Perspectives, 2021-2031 16
Figure 4. Industry Value Chain Analysis 19
Figure 5. Asia Pacific Advanced IC Substrates Market, 2021-2031, $ mn 20
Figure 6. Impact of COVID-19 on Business 25
Figure 7. Primary Drivers and Impact Factors of Asia Pacific Advanced IC Substrates Market 27
Figure 8. World 5G Devices Market by Value, 2019-2030, $ bn 31
Figure 9. World Autonomous Vehicle Market, 2019-2030, $ mn 31
Figure 10. Primary Restraints and Impact Factors of Asia Pacific Advanced IC Substrates Market 32
Figure 11. Investment Opportunity Analysis 36
Figure 12. Porter’s Fiver Forces Analysis of Asia Pacific Advanced IC Substrates Market 39
Figure 13. Breakdown of Asia Pacific Advanced IC Substrates Market by Packaging Type, 2021-2031, % of Revenue 44
Figure 14. Asia Pacific Addressable Market Cap in 2022-2031 by Packaging Type, Value ($ mn) and Share (%) 44
Figure 15. Asia Pacific Advanced IC Substrates Market by Packaging Type: FC BGA, 2021-2031, $ mn 45
Figure 16. Asia Pacific Advanced IC Substrates Market by Packaging Type: FC CSP, 2021-2031, $ mn 46
Figure 17. Asia Pacific Advanced IC Substrates Market by Packaging Type: Other Packaging Types, 2021-2031, $ mn 47
Figure 18. Breakdown of Asia Pacific Advanced IC Substrates Market by Material Type, 2021-2031, % of Sales Revenue 49
Figure 19. Asia Pacific Addressable Market Cap in 2022-2031 by Material Type, Value ($ mn) and Share (%) 49
Figure 20. Asia Pacific Advanced IC Substrates Market by Material Type: Rigid Integrated Circuit Substrate, 2021-2031, $ mn 50
Figure 21. Asia Pacific Advanced IC Substrates Market by Material Type: Flex Integrated Circuit Substrate, 2021-2031, $ mn 51
Figure 22. Asia Pacific Advanced IC Substrates Market by Material Type: Ceramic Integrated Circuit Substrate, 2021-2031, $ mn 52
Figure 23. Breakdown of Asia Pacific Advanced IC Substrates Market by Manufacturing Method, 2021-2031, % of Sales Revenue 54
Figure 24. Asia Pacific Addressable Market Cap in 2022-2031 by Manufacturing Method, Value ($ mn) and Share (%) 54
Figure 25. Asia Pacific Advanced IC Substrates Market by Manufacturing Method: Subtraction Process (SP), 2021-2031, $ mn 55
Figure 26. Asia Pacific Advanced IC Substrates Market by Manufacturing Method: Addition Process (AP), 2021-2031, $ mn 56
Figure 27. Asia Pacific Advanced IC Substrates Market by Manufacturing Method: Modified Semi-additive Process (MSAP), 2021-2031, $ mn 57
Figure 28. Breakdown of Asia Pacific Advanced IC Substrates Market by Bonding Technology, 2021-2031, % of Revenue 59
Figure 29. Asia Pacific Addressable Market Cap in 2022-2031 by Bonding Technology, Value ($ mn) and Share (%) 59
Figure 30. Asia Pacific Advanced IC Substrates Market by Bonding Technology: Wire Bonding, 2021-2031, $ mn 60
Figure 31. Picture of Wire Bonding Illustrated in a DIP Package 61
Figure 32. Asia Pacific Advanced IC Substrates Market by Bonding Technology: FC Bonding, 2021-2031, $ mn 62
Figure 33. Picture of a Flipped Chip (IC) on a Passive Substrate 63
Figure 34. Asia Pacific Advanced IC Substrates Market by Bonding Technology: Tape Automated Bonding (TAB), 2021-2031, $ mn 64
Figure 35. Breakdown of Asia Pacific Advanced IC Substrates Market by Application, 2021-2031, % of Revenue 66
Figure 36. Asia Pacific Addressable Market Cap in 2022-2031 by Application, Value ($ mn) and Share (%) 66
Figure 37. Asia Pacific Advanced IC Substrates Market by Application: Mobile and Consumer Electronics, 2021-2031, $ mn 67
Figure 38. Asia Pacific Advanced IC Substrates Market by Application: Automotive and Transportation, 2021-2031, $ mn 68
Figure 39. Asia Pacific Advanced IC Substrates Market by Application: IT and Telecom, 2021-2031, $ mn 69
Figure 40. Asia Pacific Advanced IC Substrates Market by Application: Other Applications, 2021-2031, $ mn 70
Figure 41. Breakdown of APAC Advanced IC Substrates Market by Country/Region, 2021 and 2031, % of Revenue 72
Figure 42. Contribution to APAC 2022-2031 Cumulative Market by Country/Region, Value ($ mn) and Share (%) 73
Figure 43. Advanced IC Substrates Market in Japan, 2021-2031, $ mn 75
Figure 44. Advanced IC Substrates Market in China, 2021-2031, $ mn 77
Figure 45. Advanced IC Substrates Market in Australia, 2021-2031, $ mn 79
Figure 46. Advanced IC Substrates Market in Taiwan, 2021-2031, $ mn 81
Figure 47. Advanced IC Substrates Market in South Korea, 2021-2031, $ mn 83
Figure 48. Advanced IC Substrates Market in Rest of APAC, 2021-2031, $ mn 85
Figure 49. Growth Stage of Asia Pacific Advanced IC Substrates Industry over the Forecast Period 87
Asia Pacific advanced IC substrates market will grow by 7.4% annually with a total addressable market cap of $ 99,969.7 million over 2022-2031, driven by the rising adoption of advanced substrates in manufacturing of electronics, the increasing prevalence and functionality of consumer electronic products such as smart devices and smart wearables, and the increasing penetration of advanced technologies such as 5G and IoT connected devices. Highlighted with 30 tables and 49 figures, this 109-page report “Asia Pacific Advanced IC Substrates Market 2021-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, FC Bonding, TAB), Application (Mobile and Consumer Electronics, Automotive and Transportation, IT and Telecom, Others), and Country: Trend Forecast and Growth Opportunity.” is based on a comprehensive research of the entire Asia Pacific advanced IC substrates market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2019-2021 and provides forecast from 2022 till 2031 with 2021 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) In-depth qualitative analyses include identification and investigation of the following aspects: • Market Structure • Growth Drivers • Restraints and Challenges • Emerging Product Trends & Market Opportunities • Porter’s Fiver Forces The trend and outlook of Asia Pacific market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify Asia Pacific advanced IC substrates market in every aspect of the classification from perspectives of Packaging Type, Material Type, Manufacturing Method, Bonding Technology, Application, and Country. Based on Packaging Type, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • FC BGA • FC CSP • Other Packaging Types Based on Material Type, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • Rigid Integrated Circuit Substrate • Flex Integrated Circuit Substrate • Ceramic Integrated Circuit Substrate By Manufacturing Method, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • Subtraction Process (SP) • Addition Process (AP) • Modified Semi-additive Process (MSAP) By Bonding Technology, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • Wire Bonding • FC Bonding • Tape Automated Bonding (TAB) By Application, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • Mobile and Consumer Electronics • Automotive and Transportation • IT and Telecom • Other Applications Geographically, the following national/local markets are fully investigated: • Japan • China • South Korea • Australia • Taiwan • Rest of APAC (further segmented into Malaysia, Singapore, Indonesia, Thailand, New Zealand, Vietnam, India, and Philippines) For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2021-2031. The breakdown of national markets by Packaging Type, Material Type and Application over the forecast years are also included. The report also covers current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players. Selected Key Players: ASE Group AT&S Austria Technologie & Systemtechnik AG Fujitsu Ltd. IBIDEN Co., Ltd. Kinsus Interconnect Technology Corp. Korea Circuit Co., Ltd. KYOCERA Corporation LG Innotek Co., Ltd. Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation) Shenzhen Fastprint Circuit Tech Shinko Electric Industries Co., Ltd. Siliconware Precision Industries Co., Ltd. STATS ChipPAC Pte. Ltd. TTM Technologies Inc. Unimicron Corporation Zhen Ding Technology Holding Ltd. Zhuhai ACCESS Semiconductor (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
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