List of Figures:
Figure 1. Research Method Flow Chart 11
Figure 2. Bottom-up Approach and Top-down Approach for Market Estimation 14
Figure 3. Europe Market Forecast in Optimistic, Conservative and Balanced Perspectives, 2021-2031 16
Figure 4. Industry Value Chain Analysis 19
Figure 5. Europe Advanced IC Substrates Market, 2021-2031, $ mn 20
Figure 6. Impact of COVID-19 on Business 25
Figure 7. Primary Drivers and Impact Factors of Europe Advanced IC Substrates Market 27
Figure 8. World 5G Devices Market by Value, 2019-2030, $ bn 31
Figure 9. World Autonomous Vehicle Market, 2019-2030, $ mn 31
Figure 10. Primary Restraints and Impact Factors of Europe Advanced IC Substrates Market 32
Figure 11. Investment Opportunity Analysis 36
Figure 12. Porter’s Fiver Forces Analysis of Europe Advanced IC Substrates Market 39
Figure 13. Breakdown of Europe Advanced IC Substrates Market by Packaging Type, 2021-2031, % of Revenue 44
Figure 14. Europe Addressable Market Cap in 2022-2031 by Packaging Type, Value ($ mn) and Share (%) 44
Figure 15. Europe Advanced IC Substrates Market by Packaging Type: FC BGA, 2021-2031, $ mn 45
Figure 16. Europe Advanced IC Substrates Market by Packaging Type: FC CSP, 2021-2031, $ mn 46
Figure 17. Europe Advanced IC Substrates Market by Packaging Type: Other Packaging Types, 2021-2031, $ mn 47
Figure 18. Breakdown of Europe Advanced IC Substrates Market by Material Type, 2021-2031, % of Sales Revenue 49
Figure 19. Europe Addressable Market Cap in 2022-2031 by Material Type, Value ($ mn) and Share (%) 49
Figure 20. Europe Advanced IC Substrates Market by Material Type: Rigid Integrated Circuit Substrate, 2021-2031, $ mn 50
Figure 21. Europe Advanced IC Substrates Market by Material Type: Flex Integrated Circuit Substrate, 2021-2031, $ mn 51
Figure 22. Europe Advanced IC Substrates Market by Material Type: Ceramic Integrated Circuit Substrate, 2021-2031, $ mn 52
Figure 23. Breakdown of Europe Advanced IC Substrates Market by Manufacturing Method, 2021-2031, % of Sales Revenue 54
Figure 24. Europe Addressable Market Cap in 2022-2031 by Manufacturing Method, Value ($ mn) and Share (%) 54
Figure 25. Europe Advanced IC Substrates Market by Manufacturing Method: Subtraction Process (SP), 2021-2031, $ mn 55
Figure 26. Europe Advanced IC Substrates Market by Manufacturing Method: Addition Process (AP), 2021-2031, $ mn 56
Figure 27. Europe Advanced IC Substrates Market by Manufacturing Method: Modified Semi-additive Process (MSAP), 2021-2031, $ mn 57
Figure 28. Breakdown of Europe Advanced IC Substrates Market by Bonding Technology, 2021-2031, % of Revenue 59
Figure 29. Europe Addressable Market Cap in 2022-2031 by Bonding Technology, Value ($ mn) and Share (%) 59
Figure 30. Europe Advanced IC Substrates Market by Bonding Technology: Wire Bonding, 2021-2031, $ mn 60
Figure 31. Picture of Wire Bonding Illustrated in a DIP Package 61
Figure 32. Europe Advanced IC Substrates Market by Bonding Technology: FC Bonding, 2021-2031, $ mn 62
Figure 33. Picture of a Flipped Chip (IC) on a Passive Substrate 63
Figure 34. Europe Advanced IC Substrates Market by Bonding Technology: Tape Automated Bonding (TAB), 2021-2031, $ mn 64
Figure 35. Breakdown of Europe Advanced IC Substrates Market by Application, 2021-2031, % of Revenue 66
Figure 36. Europe Addressable Market Cap in 2022-2031 by Application, Value ($ mn) and Share (%) 66
Figure 37. Europe Advanced IC Substrates Market by Application: Mobile and Consumer Electronics, 2021-2031, $ mn 67
Figure 38. Europe Advanced IC Substrates Market by Application: Automotive and Transportation, 2021-2031, $ mn 68
Figure 39. Europe Advanced IC Substrates Market by Application: IT and Telecom, 2021-2031, $ mn 69
Figure 40. Europe Advanced IC Substrates Market by Application: Other Applications, 2021-2031, $ mn 70
Figure 41. Breakdown of European Advanced IC Substrates Market by Country, 2021 and 2031, % of Revenue 72
Figure 42. Contribution to Europe 2022-2031 Cumulative Market by Country, Value ($ mn) and Share (%) 73
Figure 43. Advanced IC Substrates Market in Germany, 2021-2031, $ mn 74
Figure 44. Advanced IC Substrates Market in U.K., 2021-2031, $ mn 76
Figure 45. Advanced IC Substrates Market in France, 2021-2031, $ mn 78
Figure 46. Advanced IC Substrates Market in Spain, 2021-2031, $ mn 80
Figure 47. Advanced IC Substrates Market in Italy, 2021-2031, $ mn 82
Figure 48. Advanced IC Substrates Market in Netherlands, 2021-2031, $ mn 84
Figure 49. Advanced IC Substrates Market in Rest of Europe, 2021-2031, $ mn 86
Figure 50. Growth Stage of Europe Advanced IC Substrates Industry over the Forecast Period 88
Europe advanced IC substrates market was valued at $540.8 million in 2021 and will grow by 5.3% annually over 2021-2031, driven by the rising adoption of advanced substrates in manufacturing of electronics, the increasing prevalence and functionality of consumer electronic products such as smart devices and smart wearables, and the increasing penetration of advanced technologies such as 5G and IoT connected devices. Highlighted with 33 tables and 50 figures, this 110-page report “Europe Advanced IC Substrates Market 2021-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, FC Bonding, TAB), Application (Mobile and Consumer Electronics, Automotive and Transportation, IT and Telecom, Others), and Country: Trend Forecast and Growth Opportunity.” is based on a comprehensive research of the entire Europe advanced IC substrates market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2019-2021 and provides forecast from 2022 till 2031 with 2021 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.) In-depth qualitative analyses include identification and investigation of the following aspects: • Market Structure • Growth Drivers • Restraints and Challenges • Emerging Product Trends & Market Opportunities • Porter’s Fiver Forces The trend and outlook of Europe market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify Europe advanced IC substrates market in every aspect of the classification from perspectives of Packaging Type, Material Type, Manufacturing Method, Bonding Technology, Application, and Country. Based on Packaging Type, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • FC BGA • FC CSP • Other Packaging Types Based on Material Type, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • Rigid Integrated Circuit Substrate • Flex Integrated Circuit Substrate • Ceramic Integrated Circuit Substrate By Manufacturing Method, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • Subtraction Process (SP) • Addition Process (AP) • Modified Semi-additive Process (MSAP) By Bonding Technology, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • Wire Bonding • FC Bonding • Tape Automated Bonding (TAB) By Application, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section. • Mobile and Consumer Electronics • Automotive and Transportation • IT and Telecom • Other Applications Geographically, the following national/local markets are fully investigated: • Germany • UK • France • Spain • Italy • Netherlands • Rest of Europe (further segmented into Russia, Switzerland, Poland, Sweden, Belgium, Austria, Ireland, Norway, Denmark, and Finland) For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2021-2031. The breakdown of national markets by Packaging Type, Material Type and Application over the forecast years are also included. The report also covers current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players. Selected Key Players: ASE Group AT&S Austria Technologie & Systemtechnik AG Fujitsu Ltd. IBIDEN Co., Ltd. Kinsus Interconnect Technology Corp. Korea Circuit Co., Ltd. KYOCERA Corporation LG Innotek Co., Ltd. Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation) Shenzhen Fastprint Circuit Tech Shinko Electric Industries Co., Ltd. Siliconware Precision Industries Co., Ltd. STATS ChipPAC Pte. Ltd. TTM Technologies Inc. Unimicron Corporation Zhen Ding Technology Holding Ltd. Zhuhai ACCESS Semiconductor (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
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