Europe Advanced Packaging Market 2021-2031

Europe Advanced Packaging Market 2021-2031

Bonafide Trust 18-08-2022 99 Pages
Region : Europe Category : Chemical & Material Packaging

Europe advanced packaging market was valued at $3,029.1 million in 2021 and will grow by 8.9% annually over 2021-2031 owing to the rising demand for consumer electronics, the growing demand for high-end chips, and the cost reduction and improved efficiency brought by advancing packaging.

Advanced packaging is a supporting case that prevents physical damage and corrosion to silicon wafers, logic units, and memory, during the final stage of semiconductor manufacturing process which is very crucial to the technology sector and also to the consumers rising demands of the consumer especially in the region of Europe. Advanced packaging allows the chip to be connected to a circuit board. In addition, it involves grouping of a variety of distinct techniques, which include 2.5D, 3D-IC, fan-out-wafer-level packaging, and system-in-package. With rapid growth in the advanced packaging market, particularly in wafer level packaging, together with increased demand for smartphones and devices and the Internet of Things (IoT), advanced packaging suppliers are developing processes and ways to reduce the overall cost of advanced packaging and ensure maximum operational efficiency. In recent times, innovative packaging is primarily used for high-end products and for niche-related applications such as wafer and die processing in the region of Europe due to high operating costs. Different integrated circuits (ICs) have various packaging requirements that provide growth opportunities for advanced packaging over traditional packaging processes. Furthermore, advanced packaging is expected to offer higher capabilities than conventional packaging solutions, which are expected to provide lucrative opportunities for advanced packaging market trends in the coming years in Europe. Following the global trend the market in Europe is also widely adopting the E-commerce platform for buying almost everything. This rise in demand from the e-commerce is also expected to grow the Advanced packaging market.

The demand for compact electronic devices has increased in almost every sector, be it communication equipment, automotive, industrial or healthcare equipment. This trend has prompted semiconductor IC manufacturers to increase R&D investment in order to reduce the size and improve the output of ICs. This led to the advent of MEMS and 3D IC chips. In addition, over the decades, ICs have often been denser due to the growing number of interconnects and transistors requiring better deposition and patterning. With intensification in advancement in technologies, producers are laying emphasis in delivering the compact electronic devices in several industry verticals such as consumer electronics, healthcare, automotive, and semiconductor IC manufacturing. These producers are decreasing the size of the integrated circuits to confirm the fine patterning on the wafers and chips. In addition, medical devices industry is witnessing an increment in requirement for nano-sized robotic surgery equipment with the sophistication and advances into wearable and customized healthcare gadgets. Therefore, the trends toward compact electronic devices has generated the requirement for designers to outgrow the conventional packaging solutions and to adopt the advanced packaging. This is the reason the market in the Europe region which is experiencing boost in the home healthcare market as well as the wearable device market is contributing to the Advanced packaging market.

Furthermore, with the development in packaging technology, the functional density of the large system-on-chip solutions has augmented and this raises the market growth. Moreover, the unceasing research and developmental activities are functioned in order to develop new and innovative packaging solutions and this will hasten the growth of the advanced packaging market. Also, the growing demand for enhancing the performance of the electronic devices is projected to propel the growth of advanced packaging market.

 Impact of COVID-19

The Covid-19 pandemic affected the demand and supply of advanced packaging market. Lockdown across the globe, supply chain disorders, and oscillating supply of raw materials forced manufacturers to shut down production leading to unfortunate decline in market growth. Launch of vaccines to combat the Covid-19 pandemic is expected to contribute to the market growth over the forecast period. But still the impact of covid-19 will be long lasting with disruption in the economy along with long term demand for different products among consumers who are trying to reallocate their resources towards essential activities to get back on track.

Highlighted with 30 tables and 42 figures, this 99-page report “Europe Advanced Packaging Market 2021-2031 by Product Type (Active Packaging, Smart and Intelligent Packaging), Packaging Platform (Flip-Chip Ball Grid Array, Flip Chip CSP, Wafer Level CSP, 2.5D/3D IC, Fo-WLP, Embedded Die, Fi-WLP), End User (Consumer Electronics, IT and Telecom, Automotive and Transportation, Industrial Sector), and Country: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire Europe advanced packaging market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2018-2021 and provides forecast from 2022 till 2031 with 2021 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)

In-depth qualitative analyses include identification and investigation of the following aspects:
• Market Structure
• Growth Drivers
• Restraints and Challenges
• Emerging Product Trends & Market Opportunities
• Porter’s Fiver Forces
The trend and outlook of Europe market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19. The balanced (most likely) projection is used to quantify Europe advanced packaging market in every aspect of the classification from perspectives of Product Type, Packaging Platform, End User, and Country.

Based on Product Type, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Active Packaging
• Smart and Intelligent Packaging

Based on Packaging Platform, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Flip-Chip Ball Grid Array
• Flip Chip CSP
• Wafer Level CSP
• 2.5D/3D Integrated Circuit
• Fan Out Wafer Level Package (Fo-WLP)
• Embedded Die
• Fan In Wafer Level Package (Fi-WLP)
• Other Packaging Platforms

By End User, the Europe market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Consumer Electronics
• IT and Telecom
• Automotive and Transportation
• Industrial Sector
• Healthcare and Life Science
• Aerospace and Defense
• Other End Users

Geographically, the following national/local markets are fully investigated:
• Germany
• UK
• France
• Spain
• Italy
• Russia
• Rest of Europe (further segmented into Netherlands, Switzerland, Poland, Sweden, Belgium, Austria, Ireland, Norway, Denmark, and Finland)
For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2021-2031. The breakdown of the regional market by country and split of key national markets by Product Type, Packaging Platform, and End User over the forecast years are also included.

The report also covers current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players.
Selected Key Players:
Advanced Semiconductor Engineering Inc.
Amkor Technology, Inc.
Brewer Science, Inc.
Chipbond Technology Corporation
Intel Corporation
International Business Machines Corporation (IBM)
Microchip Technology, Inc.
Qualcomm Technologies, Inc.
Renesas Electronics Corporation
Samsung Electronics Co., Ltd.
STATS ChipPAC Pte. Ltd
SÜSS Microtec Se
Taiwan Semiconductor Manufacturing Company, Limited
Texas Instruments, Inc.
Universal Instruments Corporation
(Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)

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